Request InfoTESCANBRNO, Czech Republic, Nov. 3, 2021 — The Large Volume Workflow from TESCAN Orsay Holding AS provides fast failure and defect root-cause analysis in semiconductor manufacturing and materials research. The method implements correlative microscopy techniques to provide parallel processing through standalone laser ablation and plasma focused ion beam systems. The laser ablation system can prepare samples for multiple downstream tools, resulting in an increase in analytical throughput and productivity to reduce cost per analysis. 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