Request InfoMaster Bond Inc.For demanding applications where highly flexible, impact-resistant bonds are required, Master Bond Inc. has developed Polymer System EP37-3FLF. This optically clear, two-component epoxy exhibits good resistance to cryogenic temperatures and severe thermal cycling. Its low exo-therm also makes it a good potting, encapsulating and casting system, especially where wider cross-section thicknesses are specified. Its combination of properties allows it to cure without stressing delicate electronic components. Serviceable over the range of 4 K to 250 °F, the epoxy cures at room temperature in...See full productRelated content from Photonics MediaPRODUCTSPhotonics.com 5/24/2023Scalable Computing PlatformAdvantech’s Valor Mini Workstation is a compact industrial PC built on a mini ITX motherboard that supports Intel 10th Gen Core i processors with the H420E chipset. 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