Request InfoLogos Systems Int'lThe latest member of Logos Systems International's family of inspection systems for chip-scale packages and ball grid arrays has been released. Octaveo Model 50CSP comes with a 1.3-megapixel on-axis camera and adjustable optics for inspecting solder balls ranging from 0.1 to 0.4 mm in diameter on chips varying from 1 to 7 mm on a side. The software can handle arrays of up to 30 × 30 balls, with any amount of site depopulation desired. The 3-GHz Pentium 4 embedded PC processes chips at a rate of five to 10 parts per second, depending on the test selected.See full productRelated content from Photonics MediaWEBINARSPhotonics.com 11/18/2021Novel Solutions for XR Optical Testing: Displays, Waveguides, Near-IR, and BeyondExtended reality (XR) devices invoke a host of optical innovations — from micro-LED microdisplays to waveguide optics to near-infrared sensing systems. Combinations of these components have...Photonics.com 10/26/2023Multi-Camera Digital Image Correlation Systems for 3D Reconstruction and Pattern Recognition in PathologyThe development of omnidirectional multi-camera digital image correlation (DIC) systems to establish 3D reconstruction and pattern recognition requirements could be a potential breakthrough for...Photonics.com 4/20/2022How to Deploy and Scale Production-Ready Deep Learning in ManufacturingEnterprise-level manufacturing customers looking to leverage the power of deep learning and artificial intelligence software to solve their quality inspection applications have unique needs. Large...Photonics.com 7/19/2022The Democratization of AI-Powered InspectionHumans do a good job at visual inspection. We can spot differences and learn by example, and we are adaptable. However, when we get tired, bored, or distracted, we tend to make mistakes. For...PHOTONICS BUYERS' GUIDE CATEGORIESNoncontact Automatic Inspection SystemsVideo Inspection SystemsInspection Laser SystemsX-Ray Inspection Systems