Request InfoAlbis Optoelectronics AGGaAs photodiode arrays that support the QSFP standard have been released by Albis Optoelectronics AG. The standard defines an integrated four-channel optical transceiver that provides increased port density when replacing four standard SFP transceiver modules in Ethernet, Fiber Channel and Infiniband applications. The photodiodes provide bandwidth of 5 Gb/s per channel, and each optical aperture has a 100-μm diameter, facilitating optical alignment. Capacitance is 400 fF at bias voltages of 3 V. The chips are designed for wire bonding as well as for flip-chip soldering. Eight- and...See full productRelated content from Photonics MediaWEBINARSPhotonics.com 5/10/2023InGaAs Photodiode Detectors: Packaging, Performance, and SWIR ApplicationsVince Forte of Marktech Optoelectronics reviews InGaAs detector types, packaging, performance characteristics, and applications in the NIR and SWIR wavelength bands. He focuses particularly on photo...Photonics.com 3/27/2024Precision Planning: Simplified Laser Scanning with Predictive SoftwareConventional controllers for laser scan systems do not allow to predict the actual path of the laser beam on the work piece. A tedious process of testing different parameters and delay settings...Photonics.com 6/30/2021European Photonics Manufacturing Services Funded by ECThis event is supported by the European initiatives presented and is moderated by EPIC, the European Photonics Industry Consortium. The European Commission is helping companies access the...Photonics.com 1/9/2023Innovations in Ultrashort-Pulse and RF-Excited CO2 Lasers Expand Materials Processing ApplicationsIndustrial laser materials processing is constantly evolving. Industries as varied as pharmaceutical, consumer electronics, automotive, aerospace, and textiles, among others, have benefited from new...PHOTONICS DICTIONARY+ TERMSPhotonics Dictionarydie bondingDie bonding is a critical process in semiconductor manufacturing and microelectronics assembly, where a semiconductor die or chip is attached and electrically connected to a substrate or a package....PHOTONICS BUYERS' GUIDE CATEGORIESWire Bonding EquipmentPhotonics Integrated Component Manufacturing Equipment