Close

Search

Search Menu
Photonics Media Photonics Marketplace Photonics Spectra BioPhotonics Vision Spectra Photonics Showcase Photonics ProdSpec Photonics Handbook

Photonic Debonding Tool

Facebook Twitter LinkedIn Email
Request Info
PulseForge Inc.
The PD300 SA Photonic Debonding Tool from PulseForge Inc. is a semi-automated system suitable for wafer- and panel-level packaging, delivering a clean wafer separation solution. Designed to enable semiconductor advanced packaging for R&D and low-volume users, the tool utilizes a photonic debonding process. It leverages high-intensity pulses of light in conjunction with reusable, light-absorbing layer carriers to debond temporarily bonded materials for wafer thinning, hybrid bonding, and micro-LED transfer. The tool can debond warped wafers without expensive warpage adjustment...See full product

Related content from Photonics Media



    PRODUCTS


    ARTICLES


    PHOTONICS HANDBOOK ARTICLES


    WHITEPAPERS


    WEBINARS


    PHOTONICS DICTIONARY+ TERMS


    VIDEOS


    PHOTONICS BUYERS' GUIDE CATEGORIES


    COMPANIES


    back to top
    Facebook Twitter Instagram LinkedIn YouTube RSS
    ©2023 Photonics Media, 100 West St., Pittsfield, MA, 01201 USA, [email protected]

    Photonics Media, Laurin Publishing
    x Subscribe to Photonics Spectra magazine - FREE!
    We use cookies to improve user experience and analyze our website traffic as stated in our Privacy Policy. By using this website, you agree to the use of cookies unless you have disabled them.