Request InfoPulseForge Inc.The PD300 SA Photonic Debonding Tool from PulseForge Inc. is a semi-automated system suitable for wafer- and panel-level packaging, delivering a clean wafer separation solution. Designed to enable semiconductor advanced packaging for R&D and low-volume users, the tool utilizes a photonic debonding process. It leverages high-intensity pulses of light in conjunction with reusable, light-absorbing layer carriers to debond temporarily bonded materials for wafer thinning, hybrid bonding, and micro-LED transfer. The tool can debond warped wafers without expensive warpage adjustment...See full productRelated content from Photonics MediaPRODUCTSPhotonics.com 6/29/2023Compact UV LaserThe Spectra-Physics® Vanguard™ One™ UV125 from MKS Instruments Inc. is a compact UV laser designed for bio-instrumentation applications. 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