Request InfoFINETECH GmbH & Co. KGBERLIN, Oct. 20, 2020 — The FINEPLACER® femtoblu bonding system from Finetech GmbH & Co. KG is an automated microassembly cell for dedicated photonic production. Demanding applications benefit from a placement accuracy of 2 µm at 3σ and an ultra-low force bonding capability down to 5 gram-force. Designed for prototyping and high-yield production duties, the system supports all bonding technologies specifically required for the assembly of photonic and optoelectronic components. A complete machine enclosure minimizes external influences to ensure a stable process environment and protects the...See full productRelated content from Photonics MediaPRODUCTSPhotonics.com 9/6/2022Tilt Compensation PlatformThe Tilt Frame from UpNano GmbH is a tilt compensation platform for the two-photon polymerization (2PP) 3D printing of substrates. 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