Request InfoPlan Optik AGPlan Optik AG has expanded its range of carriers for the handling of semiconductor wafers and substrates of nonstandard shapes and sizes for processes related to semiconductors and microelectromechanical systems (MEMS). The process carriers consist of either surface-processed silicon wafers or a combination of a blank silicon wafer with a bonded glass carrier on top. They are available in many combinations (300 to 200 mm, 200 to 150 mm, etc.) and can also accommodate multiple small substrates (e.g. four 3-in. wafers on one 200-mm carrier, or hundreds of smaller sizes such as 10 ×...See full productRelated content from Photonics MediaPRODUCTSPromoted Content March 2024 IssueRaman MicroscopeThe alpha300 Semiconductor Edition from WITec is a Raman microscope configured especially for semiconductor research and development. Allowing space for the Raman imaging of wafers on a bigger scale,...Vision Spectra Winter 2023 Issue10 GigE Cameras10 GigE uEye Warp10 camera models from IDS Imaging Development Systems GmbH feature onsemi XGS sensors up to 45 MP for industrial automation. The onsemi global shutter sensors provide...Photonics Spectra April 2023 IssueUV-Optimized CMOS CameraThe Hawk Indigo UV-optimized camera from Raptor Photonics Ltd. uses a 2/3-in. CMOS sensor, enabling sensitivity and high-quantum efficiency of 36% at 250 nm. With a pixel size of 2.74 µm,...Photonics Spectra January 2024 IssueModular Microlens ArrayThe MiraLuz from SUSS MicroOptics is a modular microlens array for automotive headlights. 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