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Process Carriers

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Plan Optik AG
Plan Optik AG has expanded its range of carriers for the handling of semiconductor wafers and substrates of nonstandard shapes and sizes for processes related to semiconductors and microelectromechanical systems (MEMS). The process carriers consist of either surface-processed silicon wafers or a combination of a blank silicon wafer with a bonded glass carrier on top. They are available in many combinations (300 to 200 mm, 200 to 150 mm, etc.) and can also accommodate multiple small substrates (e.g. four 3-in. wafers on one 200-mm carrier, or hundreds of smaller sizes such as 10 ×...See full product

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