Request InfoOptotherm Inc.The latest version of OptoTherm Inc.’s Micro thermal imaging system for semiconductor failure analysis includes a new camera with a 320 × 240-element uncooled detector, 0.05 °C sensitivity, a 20-μm microscopic lens, a wide-angle lens and a 16-bit digital Camera Link interface. The system measures and displays the temperature distribution over the surface of semiconductor devices for detection of hot spots. It also calculates thermal resistance, measures junction temperature and identifies die bond defects.See full productRelated content from Photonics MediaPRODUCTSPhotonics.com 3/1/2023UV-C LEDsThe SF1-3T9B5L1 and SN3-5T9B5L1 UV-C LEDs from Silanna UV feature the TO-Can package format to protect sensitive semiconductor components within the package. 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