Request InfoValley Design Corp., HeadquartersValley Design Corp. has developed ultrathin silicon and GaAs wafers with precision-lapped, polished or chemically etched circuitries. Wafers as thin as 10 µm may be obtained. The company specializes in tight thickness specifications and fine polishing.See full productRelated content from Photonics MediaWEBINARSPhotonics.com 1/9/2023Innovations in Ultrashort-Pulse and RF-Excited CO2 Lasers Expand Materials Processing ApplicationsIndustrial laser materials processing is constantly evolving. Industries as varied as pharmaceutical, consumer electronics, automotive, aerospace, and textiles, among others, have benefited from new...Photonics.com 7/20/2023Motorized and Calibrated Lenses for Machine Vision ApplicationsMany applications have benefited from motorized varifocal lenses that allow automatic or remote adjustment of focus distance and field of view. Applications may need to change the focal length or...Photonics.com 3/7/2019In Vivo Medical Laser Procedures: An OverviewThis webinar, presented by OFS, will provide an overview of current in vivo medical procedures performed using lasers and optical fibers. The presentation will begin with a brief history of...Photonics.com 10/27/2021Fiber Optic Solutions for Medical DevicesSteve Allen provides a brief overview and examples of procedures that continue to push adoption and proliferation of optical fiber-based medical devices. From cosmetic surgery to cutting-edge sensing...COMPANIESPhotonics Buyers' GuideValley Design Corp., HeadquartersSince 1975 Valley Design Corp. has been an industry leader in advanced materials processing, as providers of precision lapping, polishing, dicing, 4- and 5-axis CNC machining, grinding, core drilling...