Search
Menu
Hamamatsu Corp. - Earth Innovations LB 2/24

ULTRATHIN SUBSTRATES

Facebook X LinkedIn Email
Request Info
Valley Design Corp., Headquarters
Valley Design Corp. has developed ultrathin silicon and GaAs wafers with precision-lapped, polished or chemically etched circuitries. Wafers as thin as 10 µm may be obtained. The company specializes in tight thickness specifications and fine polishing.See full product

Related content from Photonics Media



    WEBINARS


    COMPANIES


    We use cookies to improve user experience and analyze our website traffic as stated in our Privacy Policy. By using this website, you agree to the use of cookies unless you have disabled them.