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Zurich Instruments AG - Lock-In Amplifiers 4/24 LB

Ultra-High-Speed 3D-DIC Analysis by 2x HPV-X2

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Shimadzu Europa GmbH
Silicon (Si) wafers, are the main material for semiconductor devices, have reached a size of φ300 mm and more but have a thickness of only 1 mm or less, and great care is necessary in handling these hard, brittle wafers. Here, high-speed deformation of a Si wafers was visualized by 3D-DIC (3D Digital Image Correlation) analysis by observing the destruction of the wafer from two directions using 2x Hyper Vision HPV-X2 high-speed video cameras. The HPV-X2 ultra-high-speed camera with its unique FTCMOS2 chip does offer a recording speed of up to 10 Mio fps and down to 50 ns exposure time...See full product

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