Request InfoResonetics LLCResonetics Inc. announces a noncontact silicon wafer cutting technique, using a new laser process to cut patterns such as arcs, curves, circles and rectangles. Key features include narrow kerf widths and cutting speeds comparable to traditional straight-line dicing techniques. Typical applications include dicing optoelectronic circuits such as wavelength division multiplexers, microelectronics packaging, solid-state high-voltage components and other components requiring precise nonlinear work.See full productRelated content from Photonics MediaPRODUCTSPhotonics Spectra February 2024 IssueCMOS Image SensorsThe Emerald™ Gen2 line from Teledyne e2v is a CMOS image sensor family developed for machine vision, outdoor surveillance, and traffic detection and monitoring cameras. 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This results in the eventual showing of an event that...InGaAsP LasersInGaAlP LasersArea-Scan CamerasArea scan, in the context of imaging and cameras, refers to a method of capturing an entire two-dimensional image in a single snapshot or exposure.COMPANIESPhotonics Buyers' GuideLaCroix Precision OpticsThe LaCroix name is synonymous with quality precision optics. Since 1947, three generations of family leadership have guided LaCroix Precision Optics to become the premier precision optics...Photonics Buyers' GuideTeledyne DALSA, Machine Vision OEM ComponentsTeledyne DALSA is a part of Teledyne’s Vision Solutions group and a leader in the design, manufacture, and deployment of digital imaging components for machine vision. Teledyne DALSA image...Photonics Buyers' GuideBaumer Ltd.Baumer Group is a manufacturer of sensors, encoders, measuring instruments, and components for automated image processing. 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