Request InfoLogitech Ltd.Logitech Ltd. has unveiled a wire saw that slices samples up to 4 in. square. The AWS1, designed for use in photonics, semiconductor and geological applications, can slice gallium arsenide, silicon and lithium niobate, as well as ceramics, cements and many polycrystalline materials. Users can move the sample, viewing its position on a digital readout that has a resolution of 10 µm, and can adjust the angle of the cut with a cross-slide. The integrated abrasive system produces a lapped finish.See full productRelated content from Photonics MediaWEBINARSPhotonics.com 3/27/2024Precision Planning: Simplified Laser Scanning with Predictive SoftwareConventional controllers for laser scan systems do not allow to predict the actual path of the laser beam on the work piece. A tedious process of testing different parameters and delay settings...Photonics.com 3/7/2019In Vivo Medical Laser Procedures: An OverviewThis webinar, presented by OFS, will provide an overview of current in vivo medical procedures performed using lasers and optical fibers. The presentation will begin with a brief history of...Photonics.com 1/9/2023Innovations in Ultrashort-Pulse and RF-Excited CO2 Lasers Expand Materials Processing ApplicationsIndustrial laser materials processing is constantly evolving. Industries as varied as pharmaceutical, consumer electronics, automotive, aerospace, and textiles, among others, have benefited from new...Photonics.com 7/22/2021STANDARDS UPDATE: Vision Standards: An Overview of Global and A3 DevelopmentsStandards play a key role in the vision and imaging industry by ensuring interoperability of components, increasing market size, and shortening the time it takes to get new products to market. As the...