Request InfoVI Systems GmbHVI Systems GmbH offers high-speed electrical and optical testing of wafers early in the manufacturing process using a semiautomatic wafer probing station. The system reduces manufacturing costs by eliminating out-of-specification wafers before they have been cut and packaged to improve yield. It also offers high-speed characterization at the wafer level. Test parameters include optical output power and optical spectrum. Electrical parameters include operation voltage, bias voltage, drive current and dark current. In addition, a high-frequency characterization test of up to 38 GHz...See full productRelated content from Photonics MediaPRODUCTSPhotonics Spectra August 2023 IssueWarpage Metrology ToolThe Wave3000 warpage metrology tool from ERS electronic GmbH is designed for advanced packaging wafers and the semiconductor manufacturing industry. 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Also on this...PHOTONICS BUYERS' GUIDE CATEGORIESCoordinate Measurement SystemsSurface Analysis Laboratory ServicesOptical TestingOptical testing uses a variety of methods and tools to determine the surface contour and performance of optical components and systems.Spectrophotometry ServicesCOMPANIESPhotonics Buyers' GuideShanghai Optics Inc.ISO 9001 & ISO 13485 certified and D&B DUNS # 113515303 Shanghai Optics is an unparalleled custom system solution provider offering advance precision custom optical design, engineering,...Photonics Buyers' GuideOptikos CorporationThe Optical Engineering Experts® Optikos designs and manufactures metrology products for measuring and assuring optical image quality; and provides optical engineering design, development,...Photonics Buyers' GuideAvantier Inc.Avantier Inc. is an unparalleled leader in providing innovative imaging systems solutions and optical systems solutions. We offer advance precision custom optical design, optical engineering...Photonics Buyers' GuideValley Design Corp., HeadquartersSince 1975 Valley Design Corp. has been an industry leader in advanced materials processing, as providers of precision lapping, polishing, dicing, 4- and 5-axis CNC machining, grinding, core drilling...