Request InfoACE Solution Co. Ltd.ZHUBEI CITY, Taiwan, March 2, 2023 — The TZ6000 nondestructive wafer quality measurement tool from ACE Solution Co. Ltd. is incorporated with TeraView’s TeraPulse Lx technologies for use in the compound semiconductor industry. The tool measures thickness, refractive index, resistivity, dielectric constant, surface and subsurface defects at selected positions, and whole wafer scanning map. Terahertz analysis meet the needs of the material inspection in imaging, spectroscopy, and semiconductor applications with a 3200-ps time-delay line. The system’s modular architecture and TeraView patented laser-gated...See full productRelated content from Photonics MediaPRODUCTSPhotonics.com 3/25/2024Wafer Inspection SystemThe LS9300AD from Hitachi is a system for inspecting the front and backside of non-patterned wafer surfaces for particles and defects. 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