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SUBMICRON BONDER

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Finetech Inc. has released the Opto-Bonder Femto, its latest device for the assembly of optoelectronic components and modules. The bonder can handle various assembly technologies, including power laser and laser bar binding, flip chip and VCSEL bonding, MEMS and MOEMS, and sensors. It features high accuracy of ±0.5 μm in a small footprint of 1270 × 900 mm. New features include a 25% larger table, motorized X-Y-Z and theta movements, and a substrate with a diameter up to 6 in. with automatic pattern recognition. Bonding processes are automatically controlled and require no operator intervention during the alignment and bonding procedure.


Photonics Spectra
Apr 2007
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