SWIR InGaAs Component

New Imaging Technologies (NIT)Request Info
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VERRIERES LE BUISSON, France, March 5, 2020 — SWIR InGaAs Component A SWIR InGaAs component with a pitch of 7.5 µm has been announced by New Imaging Technologies.

Through a hybridization process, which does not use the traditional indium bumps technique, allows manufacturing hybrid sensors with very small pitches, a high yield, and reduced cost. The first available component with a 7.5-µm pitch is a line array with 2048 pixels, a line speed of 60 KHz at full line, a well fill of 25 Ke, a readout noise of <70 e, and a dark current of 8 fA at 15° C.

Published: March 2020
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ProductsSWIR InGaAs ComponentNew Imaging TechnologiesOpticsImagingEurope

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