Semiconductor Metrology Instrument
Rigaku Corp.Request Info
TOKYO, Dec. 31, 2025 —
The ONYX 3200 from Rigaku is a semiconductor metrology system to measure film thickness, composition, and bump structures for wafer-level processes. The system is engineered to help stabilize quality and increase yield in the metal-wiring formation and packaging processes of semiconductor chips. The instrument uses a 3D confocal scanner to inspect the shapes and heights of microscopic bumps and electroconductive metal patterns in 3D with high precision. The ONYX 3200 has a dedicated x-ray head capable of detecting silver content as low as 2% within tin-and-silver bumps with an exceptional precision of 4 parts per 100,000, providing rigorous materials ratio control for packaging yield.
https://rigaku.com
/Buyers-Guide/Rigaku-Corp/c34640
Published: December 2025
From the Photonics Marketplace
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