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Semiconductor Adhesive
DELO Industrial AdhesivesRequest Info
SUDBURY, Mass., July 13, 2020 — 
The MONOPOX TC2270 adhesive from DELO Industrial Adhesives LLC is designed for power semiconductors with thermal conduction and electric insulation.
The adhesive provides strength even after standardized humidity tests with subsequent reflow cycles. It ensures fast heat transfer and long-term reliable operation of semiconductors in power electronics, providing both heat dissipation and electrical insulation of assemblies. After curing, the adhesive provides a compression shear strength of 34 MPa on the FR4 composite material and 11 MPa on high-performance liquid-crystal polymer plastics. When bonding microchips, the adhesive reaches values of 60 N in the die shear test.
Due to its aluminum nitride ceramic filler, the one-component, heat-curing epoxy resin provides high thermal conductivity of 1.7 W/mK.
http://www.delo-adhesives.com/us
https://www.photonics.com/Buyers_Guide/DELO_Industrial_Adhesives/c23363
Photonics.com
Jul 2020
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