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Silicon Photonics Die Bonder

MRSI SystemsRequest Info
 
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TEWKSBURY, Mass., Oct. 15, 2020 — Silicon Photonics Die BonderThe MRSI-S-HVM high-speed, flexible 0.5-μm die bonder from MRSI Systems is designed for silicon photonics, co-packaging electronic and photonic chips, and wafer-level packaging.

The die bonder is based on the high-speed HVM die bonder platform for high-volume manufacturing of integrated photonics. It uses multiple levels of parallel processing and has a high level of flexibility for multiple die applications. Flexibility allows automatic switching between 0.5- and 1.5-μm accuracy modes. The 0.5- μm mode uses a real-time alignment mechanism facilitated by the on-axis z-force bonding for the best possible co-planarity and final accuracy. For flip-chip bonding, it aligns the features on the bonding surfaces of the die and the carrier, eliminating the expensive step of making alignment fiducials on both top and bottom sides of a chip during wafer fabrication. It also eliminates the subsequent die bonder alignment step in order to calibrate the top and bottom surface of the chip.

Three heating options of high-density top heating eutectic bonding, bottom thermal heating, and a proprietary bottom laser soldering solution are available.


Photonics.com
Oct 2020
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ProductsSilicon Photonics Die BonderMRSI-S-HVMMRSI SystemsWaferssiliconopticsAmericas

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