Search
Menu

Systems-On-Chip Interconnect Solutions

MaxLinear Inc.Request Info
 
Facebook X LinkedIn Email
CARLSBAD, Calif., March 1, 2018 — The Telluride MxL935XX series of 400-Gbps pulse-amplitude-modulation (PAM4) digital signal processing (DSP) systems-on-chip (SoC) solutions from MaxLinear Inc. are designed for the high-speed optical interconnect needs of megascale cloud and enterprise data centers.

The MxL935XX device allows system vendors to develop a 400-Gbps optical interconnect module in a compact form factor for intradata center applications with a transmission distance up to 2 km. They are capable of one, two or four lanes of 100-Gbps optical connectivity combined with a flexible 25-G NRZ and 50-G PAM4 electrical interface.

The MxL935XX 16-nm CMOS PAM4 DSP SoC consumes an extremely low power of 6.7 W, which includes the integrated EA-EML driver power dissipation. The minimal power consumption of the MxL935XX meets the stringent power constraints of 400-Gbps optical module form factors.



Published: March 2018
REQUEST INFO ABOUT THIS PRODUCT
* First Name:
* Last Name:
* Email Address:
* Company:
* Country:
Message:


When you click "Send Request", we will record and send your personal contact information to MaxLinear Inc. by email so they may respond directly. You also agree that Photonics Media may contact you with information related to this inquiry, and that you have read and accept our Privacy Policy and Terms and Conditions of Use.

Register or login to auto-populate this form:
Login Register
* Required

ProductsSystems-On-Chip Interconnect SolutionsCommunicationsTellurideMxL935XXOptics

We use cookies to improve user experience and analyze our website traffic as stated in our Privacy Policy. By using this website, you agree to the use of cookies unless you have disabled them.