Thermal Interface Material

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PITTSBORO, N.C., Dec. 8, 2023 — SigmaOx Thermal Interface MaterialThe SX-25 thermal paste from SigmaOx is a thermal interface material meant for use with high-speed chipsets and graphic processors. Formulated as a hybrid phase change material without diluents or solvents, the paste draws heat away from components with a thermal conductivity of 25.0 W/m-K. The SX-25 is engineered to resist pump-out, outgassing and phase separation, which helps to mediate concerns over silicone deposition on sensitive optics and electronics, and is halogen-free and fully RoHS and REACH compliant.

Published: December 2023
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