Two-Component Epoxy Bonding Material
Incure Inc.Request Info
NEW BRITAIN, Conn., Sept. 12, 2018 —
The Epo-Weld HTE-6468 two-component epoxy bonding material from Incure Inc. offers effective bonding and filling properties on many substrates.
With a fast pot life setting of 3 minutes, bonding strength starts increasing after 15 minutes, and a full cure exists at 72 hours at room temperature. Incure HTE-6468 cures to a high-gloss black surface encapsulant with exceptional high-temperature and chemical resistance.
http://www.uv-incure.com
https://www.photonics.com/Buyers_Guide/Incure_Inc/c31241
Photonics.com
Sep 2018