Ultra-High-Speed 3D-DIC Analysis by 2x HPV-X2

Silicon (Si) wafers, are the main material for semiconductor devices, have reached a size of φ300 mm and more but have a thickness of only 1 mm or less, and great care is necessary in handling these hard, brittle wafers. Here, high-speed deformation of a Si wafers was visualized by 3D-DIC (3D Digital Image Correlation) analysis by observing the destruction of the wafer from two directions using 2x Hyper Vision HPV-X2 high-speed video cameras. The HPV-X2 ultra-high-speed camera with its unique FTCMOS2 chip does offer a recording speed of up to 10 Mio fps and down to 50 ns exposure time without troubling the user for artifacts, etc. in the images.

Recording from two directions enables highly accurate 3-dimensional measurement considering deformation in the out-of-plane direction. Because the two HPV-X2 cameras are connected by a synchronization cable, synchronized recording in which the phases of the recording frames coincide is exactly possible, offers the possibility to obtain the distribution of displacement during the moment of breaking. This condition of change can hardly be observed visually in the recorded images. However, from the analytical results, it can be understood that displacement increases progressively in a concentric manner from the central part of the specimen. This knowledge is used to improve handling technology of this precious Si wafer.