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Ultrasonic and Laser Bonding

F&K Delvotec Inc.Request Info
 
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Ultrasonic and Laser Bonding• 15-mm-deep access option on ball bonding provides highest clearance in the market.
• RGB light provides good contrast that improves image quality.
• Bond-process feature monitors and controls the ultrasonic, deformation, and bond time throughout the bonding process to ensure bond quality consistency.
• Our ball-, wedge-, and laser-bond technologies cover applications required by automotive, aerospace,


Photonics Showcase
Jun 2021
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