Ultrasonic and Laser Bonding
F&K Delvotec Inc.Request Info
• 15-mm-deep access option on ball bonding
provides highest clearance in the market.
• RGB light provides good contrast that
improves image quality.
• Bond-process feature monitors and controls
the ultrasonic, deformation, and bond time
throughout the bonding process to ensure
bond quality consistency.
• Our ball-, wedge-, and laser-bond technologies
cover applications required by automotive,
aerospace,
https://www.fkdelvotec.com/en
https://www.photonics.com/Buyers_Guide/FK_Delvotec_Inc/c4688
Photonics Showcase
Jun 2021