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Ultraviolet Laser

LPKF Laser & Electronics AGRequest Info
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LPKF Laser & Electronics AG has introduced an economical cutting laser for industrial printed circuit board (PCB) manufacturing. The MicroLine 1000 S is used for depaneling and UV laser cutting of assembled PCBs. The UV laser can cut substrates located right next to delicate components or circuit paths without causing any mechanical stress or thermal interference, enabling production of small subassemblies with high densities. The tool-less method makes any contour possible. Changes to the cutting paths are made via programming the included software or right in the CAD software. The system is suitable for cutting break-out tabs and complex contours with high accuracy. The UV laser makes clean, burr-free cuts in FR4, FR5, CEM, ceramic, polyimide, polyester and other PCB substrates. It cuts PCBs measuring up to 250 x 350 mm. With a focus width of 20 μm, the beam cuts very narrow channels and accommodates tight radii.

Oct 2010

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break-out tabsburr-free cutsCAD softwareCEMceramiccircuit pathdepanelingEuropeFR4FR5industrialLPKFLPKF Laser & Electronics AGmechanical stressMicroLine 1000 Snarrow channelsPCBPCB substratesPCBspolyesterpolyimideprinted circuit board manufacturingProduct Previewsubassembliesthermal interferencetight radiiultraviolet laserUV laserUV laser cuttinglasers

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