VCSEL Array
TriLumina Corp.Request Info
The surface-mount flip-chip back-emitting vertical-cavity surface-emitting laser (VCSEL) from TriLumina Corp. enables low cost and high performance for mobile 3D sensing applications and NIR illumination.
The array is flip-chip packaged and used in automotive lidar prototypes for low-power mobile and in-cabin 3D sensing applications. Designed for use without submount or bond wires, the 4-W chip-on-board device is a compact, surface-mountable design, consisting of a single VCSEL array die that can be mounted on a printed circuit board.
The compact technology can be used in 3D sensing applications and NIR illumination options for replacing existing LEDs in NIR camera systems, mobile cameras, in-cabin occupant monitoring, and augmented reality systems.
https://www.trilumina.com
https://www.photonics.com/Buyers_Guide/TriLumina_Corp/c31808
Photonics Spectra
Sep 2019
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