Wafer-Level Camera Module

OmniVision Technologies Inc.Request Info

SANTA CLARA, Calif., Jan. 29, 2020 —

The OC0VA CameraCubeChip^™ wafer-level camera module from OmniVision Technologies Inc. features PureCel^® Plus-S stacked pixel architecture and Nyxel^® NIR technology to enable optimal performance and precision.

The OC0VA camera module features a 2.69×3.04-mm footprint, enabling thin- and zero-bezel devices. Its high modulation transfer function enables sharper images with greater contrast and more detail, helping to enhance machine vision decision-making processes.

The camera is ideal for a wide range of consumer, industrial machine vision, and 3D sensing applications that require a global shutter and top NIR performance to reduce system power consumption. Target applications include facial authentication and eye tracking in smartphones and notebooks, as well as imaging for augmented/virtual reality headsets, drones, and robots.

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Photonics.com
Jan 2020

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Wafer-Level Camera Module