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Wafer Bonding Aligner

EV Group (EVG)Request Info
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ST. FLORIAN, Austria, July 27, 2018 — Wafer Boding AlignerThe SmartView NT3 aligner on the GEMINI FB XT fusion bonder from EV Group enables 2 to 3× improvement in wafer bond alignment and overlay performance over previous-generation aligners.

With the SmartView NT3 aligner, the GEMINI FB XT provides integrated device manufacturers, foundries, and outsourced semiconductor assembly and test providers with wafer bonding performance that is unmatched in the industry and can meet their future 3D-IC packaging requirements. Developed specifically for fusion and hybrid wafer bonding, the SmartView NT3 aligner provides sub-50-nm wafer-to-wafer alignment accuracy.

Applications enabled by the GEMINI FB XT include memory stacking, 3D systems-on-chip, backside illuminated CMOS image sensor stacking, and die partitioning.
Jul 2018

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ProductsSmartView NT3wafer bonding alignerWafersEV GroupEurope

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