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Wafer Inspection System

Photonics.com
Dec 2018
Rudolph TechnologiesRequest Info
 
WILMINGTON, Mass., Dec. 11, 2018 — Wafer Inspection SystemThe NovusEdge system from Rudolph Technologies Inc. is designed for edge, notch, and backside inspection of unpatterned wafers.

The NovusEdge system meets the stringent new requirements for defect control at the edge and backside of wafers being manufactured for 10-nm process nodes. The system provides up to 50 percent faster throughput and two orders of magnitude better edge sensitivity than incumbent technology.

The NovusEdge system uses multiple cameras and advanced imaging technologies to build a high-resolution, composite image of the entire wafer bevel, and then applies sophisticated analytical routines to identify and classify defects as small as the sub-μm level. On the backside, it utilizes high-speed laser-scanning to detect particles, scratches, area defects, and haze.


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