Henkel AdhesivesHysol FP4548FC is a high-purity liquid epoxy encapsulant material from Henkel Corp.’s Electronics Div. that is designed as an underfill for flip-chip devices that require crack and fracture resistance. Its low coefficient of thermal expansion and low shrinkage properties make it suitable for low k die applications. When fully cured, the material creates a rigid, high-strength seal that dissipates solder joint stress, extends thermal cycling performance and simplifies assembly. It is compatible with lead-free manufacturing requirements and is qualified for JEDEC Level 3/260 °C.See full productRelated content from Photonics MediaPRODUCTSBioPhotonics Jan/Feb 2024 IssueDirect-Drive Rotation StagesThe V-622, V-623, and V-625 from PI are high-performance rotary stages equipped with frictionless electromagnetic torque motors and precision ball bearings. 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