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LETI Products
Integrated Circuit Multiproject Wafer Process
GRENOBLE, France, Sept. 3, 2018 — Leti has announced a multiproject-wafer (MPW) process for the integrated-circuit industry, fabricating emerging nonvolatile memory OxRAM (oxide-based resistive RAM) devices on a 200-mm foundry base-wafer platform. Available on Leti’s 200mm CMOS line, the MPW service provides a comprehensive, low-cost way to explore techniques designed to achieve miniaturized, high-density components. Including Leti’s Memory Advanced Demonstrator (MAD) future mask set with disruptive OxRAM...
CEA-Leti
Request info >
Photonics Circuit Process Design Kit
GRENOBLE, France, April 30, 2018 — A silicon photonics process design kit (PDK) designed for photonics circuits is now available in the Synopsys PhoeniX OptoDesigner suite from Leti. Leti’s integrated silicon photonics platform has been developed for high-speed optical...
CEA-Leti
Request info >
Wide Video Graphic Array GaN Microdisplay
GRENOBLE, France, June 2, 2017 — CEA-Leti has announced a wide video graphic array GaN microdisplay with a 10-µm micropitch. The 10-µm pixel pitch technology will help address the growing demand for augmented-reality glasses for consumer and professional users,...
Request info >
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May 2024
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Rare-Earth Doped Fibers Deliver Critical Elements to Dynamic Systems
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, May 2024
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