Tyndall, MIT Partner on Sustainable Chip Production Processes: Week in Brief: 5/3/24
CORK, Ireland, May 3, 2024 — Researchers from the Tyndall National Institute’s photonics packaging & systems integration group have been awarded funding by the National Science Foundation to diversify and strengthen the supply chain for manufacturing and packaging of semiconductor devices. This is through the FUTUR-IC project led by MIT, which was created to bring together stakeholders from industry, academia, and government to co-optimize technology, ecology, and workforce across three dimensions. The Tyndall