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bonding News
CEA-Leti and Intel Report on Hybrid Direct-Bonding Self-Assembly Process
SAN DIEGO, July 6, 2023 — CEA-Leti and Intel have optimized a hybrid direct-bonding, self-assembly process that increases alignment accuracy as well as fabrication throughput by several thousand dies per hour. The approach uses capillary forces of a water droplet to align dies on a target wafer. Although the microelectronics industry sees the die-to-wafer (D2W) hybrid bonding process as essential for the success of future high-performance computing (HPC) and photonic devices, it’s far more complex than
CEA-Leti, Intel Advance Die-to-Wafer Self-Assembly Process
SAN DIEGO, June 6, 2022 — CEA-Leti reported the optimization of a hybrid direct-bonding, self-assembly process with the potential to increase the alignment accuracy as well as fabrication throughput of die-to-wafer (D2W) bonding. The work is part of a collaboration with...
Novel Bonding Technology Improves Optical Assemblies
Mar 1, 2013 — Activated covalent bonding overcomes the optical performance and laser damage limitations of traditional adhesive techniques and also can be used with mid-IR components. Optical components and assemblies in which elements are bonded together using...
Spot Curing
Oct 5, 2010 — IRphotonics of Hamden, Conn., an infrared-based materials and systems manufacturer, announced that its iCure spot curing system has completed qualification and production acceptance with an undisclosed US medical device manufacturer. After six...
VI Systems Begins Shipping Circular VCSEL Arrays
BERLIN, Aug. 16, 2010 — VI Systems GmbH has released the first circular chip arrays of its vertical cavity surface emitting laser (VCSEL) designed for wire- and flip-chip bonding. With seven channels for data rates of up to 5 Gbit/s per channel, the VCSEL delivers an...
Measurement of centering errors, automated adjustment and mounting of lenses
Jun 9, 2010 — Classical optical measurement techniques combined with modern PC technologyprovide accurate alignment, bonding and cementing of optical components and systems. These processes are fully automated and significantly reduce production time and cost....
Follow-On Order
Jun 7, 2010 — St. Florian, Austria-based EV Group, a wafer bonding and lithography equipment supplier, has announced that Morocco-based wafer-level camera manufacturer 18314%%Nemotek Technologie has placed a repeat order for its bonding and UV nanoimprint...
Wafer Bonding Agreement
Mar 18, 2010 — 3M of St. Paul, Minn., an advanced materials supplier for the semiconductor industry, and Tazmo Co. Ltd. of Okayama, Japan, an LCD manufacturing equipment and semiconductor supplier, have announced an agreement allowing the latter company to...
Minimizing Error and Maximizing Precision in Microassembly
Apr 1, 2003 — Precision assembly solutions are as unique as the products they are built to automate, especially in the photonics world. Progressive assembly operations such as guiding, gluing and bonding sometimes take place in a local region around a static...
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May 2024
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