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computers Products
Chiplet Interconnect
SAN DIEGO, March 27, 2024 — The LightBundle™ from Avicena is a scalable chiplet interconnect for extending high bandwidth memory modules and die-to-die connections from GPUs. Able to extend connections up to 10 m, the chiplets can dissipate < 1pJ/bit for optical interconnects and support multi-Tbps/mm beachfront density. The LightBundle chiplets are compatible with standard multichip packaging and support a wide range of die-to-die interfaces including standard and advanced versions of UCIe and BOW.
Avicena Tech Corp.
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Industrial Computer
NEW TAIPEI, Taiwan, Feb. 21, 2024 — The DI-1200 from Cincoze is a compact, high-performance industrial computer for applications with limited space and power supply, such as mobile devices, in-vehicle, or outdoor environmental monitoring. With a 12th-gen Intel® Core™...
Cincoze Ltd.
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Rugged AI Computers
TAIPEI, Taiwan, Feb. 9, 2024 — The PCle-NX150 series of frame grabbers and NRU-150-FT flattop heatsink edge AI series from Neousys Technology are Jetson Orin™ NX computers designed for AI capabilities in existing rule-based machine vision or surveillance systems. The...
Neousys Technology Inc.
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Servo Motor Drives
PITTSBURGH, Jan. 30, 2024 — The Automation1 XA4 and iXA4 from Aerotech Inc. are PWM single- and multi-axis panel-mounted servo motor drives with full motion control and I/O expansion options. The XA4 communicates to Automation1 PC- and drive-based controller products over the...
Aerotech Inc.
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Expandable AI Computing System
NEW TAIPEI CITY, Taiwan, Jan. 26, 2024 — The RCX-3000 PEG from Vecow is an expandable AI computing system based on a 13th Intel® Core™ i9/i7/i5/i3 processor. The rugged system is equipped with versatile I/O interfaces and provides DC-in and AC power input options. The computer...
Vecow Co. Ltd.
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Computers and Monitor Module
TAIPEI, Taiwan, Sept. 8, 2023 — The DS-1400 series and M1101 from Cincoze are industrial components made for powerful large-scale, real-time image processing computation required by the emergence of Edge AI. The DS-1400 series computers support 12th gen Intel® Alder Lake-S...
Cincoze Ltd.
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EP30M3LV Epoxy System
HACKENSACK, N.J., Sept. 16, 2009 – Master Bond Inc.’s EP30M3LV polymer is a low-exothermic two-component epoxy system formulated to help avoid excess heat buildup and damage to thermally sensitive components during chemical-resistant casting and potting operations. Part...
Master Bond Inc.
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(7 results found)
May 2024
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Features
Rare-Earth Doped Fibers Deliver Critical Elements to Dynamic Systems
Photonics Spectra
, May 2024
Bottlenecks in Process and Production Hinder Micro-LED Adoption
Photonics Spectra
, May 2024
Beam Deflection Units Increase the Efficiency of Laser Powder Bed Fusion
Photonics Spectra
, May 2024
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