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wafer processing News
Nanoimprint Lithography Enables Cost-Effective Photonics Production
Feb 13, 2015 — The ability to create wafer-scale stitching-error-free patterns of nanostructures on bowed and warped surfaces and even on topography, as well as direct patterning of 3-D structures, makes nanoimprint lithography ideally suited for the needs of a diversified photonics market. Photonics applications are emerging rapidly, thanks to the fabrication infrastructure of the semiconductor industry that enables new functionalities, smaller form factors, improved performance and reduced costs.
ESI to Acquire Semiconductor Systems from GSI Group
PORTLAND, Ore., April 11, 2013 — Electro Scientific Industries Inc. is acquiring the Semiconductor Systems unit of precision photonics supplier GSI Group Inc., ESI announced Wednesday. The transaction will bring together two providers of systems for laser-based wafer processing.
Jenoptik Expands in Berlin, China
Feb 1, 2012 — Laser and optical systems manufacturer Jenoptik of Jena, Germany, is doubling its semiconductor laser capacity with a ⇔10 million (about $13.2 million) expansion of its Berlin-Adlershof site. The larger facility is expected to be available for...
Wafer Processing
Jul 1, 2010 — Axus Technology and CMP Solutions have announced a partnership that expands the chemical mechanical polishing (CMP) and wafer thinning process for both companies. The agreement is anticipated to link the process development expertise of the latter...
J.P. Sercel Expands into Malaysia
Aug 1, 2008 — J.P. Sercel Associates of Manchester, N.H., has opened a customer service and support office in Malaysia to provide service and spare parts for the company’s laser workstations for wafer processing and micromachining in Malaysia, China and Singapore.
Rudolph Technologies Secures RVSI Inspection IP, Assets
Mar 1, 2008 — Rudolph Technologies Inc. of Flanders, N.J., has acquired all intellectual property and selected assets from RVSI Inspection LLC of Hauppauge, N.Y. The New Jersey company provides process characterization equipment and software used in wafer...
JPSA Begins Move to New Facility
Sep 21, 2006 — JP Sercel Associates (JPSA), a supplier of laser micromachining and wafer processing technology, announced it has begun moving into a 35,000-sq-ft facility in Manchester, N.H. (photo below), about a 30-minute drive north from its current...
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May 2024
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