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optoelectronic components Products
BONDER
Apr 1, 2008 — Finetech GmbH & Co. KG has expanded its Fineplacer product line with the introduction of the Fineplacer Femto, an automated submicron bonder for assembly of optoelectronic components. It can be used to assemble and bond laser bars and diodes,...
FINETECH GmbH & Co. KG
Request info >
SUBMICRON BONDER
Apr 1, 2007 — Finetech Inc. has released the Opto-Bonder Femto, its latest device for the assembly of optoelectronic components and modules. The bonder can handle various assembly technologies, including power laser and laser bar binding, flip chip and VCSEL...
FINETECH
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Opti-tec 7020 Clear Silicone Potting Compound
OXFORDSHIRE, England, Aug. 14, 2006 -- The Opti-tec 7020 clear silicone potting compound from Intertronics provides true nonyellowing optical clarity for light transmission and protection for potting of sensitive optoelectronic components such as LEDs, displays or solar panels, while...
Intertronics
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Free-Light Compact
Dec 15, 2005 — PETAH-TIKVA, Israel, Dec. 15 -- Civcom, a manufacturer of optoelectronic components and subsystems, has introduced a Free-Light Compact (only 3.34 by 2.87 by 0.53 inches) high-performance, long-reach 10 Gb/s tunable transponder that provides optical...
Civcom D & S
Request info >
Free-Light Compact
Dec 1, 2005 — PETAH-TIKVA, Israel, Dec. 15 -- Civcom, a manufacturer of optoelectronic components and subsystems, has introduced a Free-Light Compact (only 3.34 by 2.87 by 0.53 inches) high-performance, long-reach 10 Gb/s tunable transponder that provides optical...
Civcom D & S
Request info >
OE DEVICE PACKAGING
Feb 1, 2004 — Custom packaging of optoelectronic components to meet commercial, industrial and military fiber optic applications is offered by Laser Diode Inc. Package styles include industry-accepted DIL, mini-DIL, butterfly, coaxial and TO. Packaging of...
OSI Laser Diode Inc.
Request info >
(6 results found)
April 2024
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