Fan-Out-Package-on-Package
SUNNYVALE, Calif., March 22, 2023 — The Fan-Out-Package-on-Package (FOPoP) solution from Advanced Semiconductor Engineering Inc. is designed to lower latency and deliver bandwidth advantages for the dynamic mobile and networking markets.
Positioned under the VIPack™ platform, FOPoP reduces the electrical path by 3× and enables bandwidth density by up to 8×, allowing engine bandwidth expansion up to 6.4 Tbps/unit. Interconnect capabilities, proximity driven impedance enhancements, stacked vias, and vertical...
Advanced Semiconductor Engineering Inc. (ASE)