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Precision Automation Principles for the Optimal Testing and Packaging of PIC Devices

Jan 12, 2023
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Presented by
Aerotech Inc.
Production-scale testing of silicon photonic devices continues to be a challenge due to the multi-degree-of freedom, high-precision optical alignments required for wafer- and die-level testing. Wide variances in chip designs and coupling features complicate test procedures, making it difficult to identify a system capable of producing repeatable measurements across various topologies. Heintz provides a guide for selecting precision motion equipment to minimize the impact of positioning errors on optical alignment test results.

First, he introduces terminology typically used in the precision automation industry and the terms’ relationships to optical alignments. Next, Heintz discusses the fundamental principles of motion control and their impact on alignment quality. Finally, he presents a case study on error motions induced by 6-degree-of-freedom positioning devices and their impact on optical alignments to illustrate the importance of selecting the optimal positioning equipment for a given alignment application.

***This presentation premiered during the 2023 Photonics Spectra Conference. For more information on Photonics Media conferences, visit

About the presenter

Brett HeintzBrett Heintz is an applications engineer at Aerotech Inc. He focuses on the technical challenges associated with the design, production, and programming of precision automation systems for optoelectronic packaging and testing. Heintz received his bachelor’s degree in engineering physics and his master’s degree in electrical and computer engineering from the University of Pittsburgh.
Test & Measurementphotonic integrated circuitsPICspositioningsilicon photonicspackaging
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