How Electro-Optic Polymers Boost PIC Speed and Power Efficiency

Jan 12, 2023
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About This Webinar
Steadily growing demand for bandwidth continues to put pressure on data centers and optical networks to increase the speed of their optoelectronic components while decreasing overall power consumption. This pressure has fueled interest in electro-optic polymer materials, enabling a new generation of modulators demonstrating ultrahigh speed and ultralow power in transceivers, line cards, servers, and routers. Further, these electro-optic polymers offer expanded latitudes for hybrid integrated photonic chips by allowing integration with incumbent silicon or indium phosphide photonic chip platforms.

The current class of polymer modulators enabled by this technology can deliver 3-dB bandwidths over 100 GHz with sub-1-V voltages in devices with extremely small (<1-mm length) footprints. The modulators are highly suitable for powering optical engines designed for pluggable transceivers and/or co-packaged modules.

Lebby reviews the potential solutions that electro-optical polymer modulators offer to integrated and hybrid photonics integrated chips (PICs), and he discusses their relevance to PIC packaging operations.

***This presentation premiered during the 2023 Photonics Spectra Conference. For more information on Photonics Media conferences, visit

About the presenter

Michael LebbyMichael Lebby, Ph.D., has served as Lightwave Logic’s CEO since May 1, 2017, and as a director at the company since Aug. 26, 2015. He has served as president and CEO of OneChip Photonics Inc., a privately held company headquartered in Ottawa, Canada, that is a leading provider of low-cost, small-footprint, high-performance indium phosphide (InP)-based PICs and PIC-based optical subassemblies (OSAs) for the data center markets. Also, from 2013 to 2015 Lebby served as part-time full professor and chair of optoelectronics at Glyndwr University in Wales to bring forward advanced materials, device, and integrated photonics-based technologies for the data center and high-performance computing markets.

During the period from 2014 to 2016, he focused on a foundry-based model for InP-based PICs and optoelectronic ICs (OEICs) in the data center segment, and he has been instrumental in assembling California’s proposal (via the University of Southern California) to the federal government for an integrated photonics manufacturing institute. Lebby earned a doctorate in engineering, an MBA, and a bachelor’s degree, all from the University of Bradford in England. He has over 200 issued utility patents with the U.S. Patent and Trademark Office, and this number expands to over 450 when international derivative patents are included.
polymersphotonic integrated circuitsPICspackaging
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