Bridging the Gap: Scaling Low-Loss PICs for Breakthrough Applications

Jan 17, 2024
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About This Webinar
Geiselmann presents progress on scaling the fabrication of low-loss photonics integrated circuits (PICs) to volume. He highlights application spaces ranging from sensing to optical computing, including quantum computing and telecommunication, where low loss PICs are crucial to enable a technological breakthrough. He discusses options of active integration, such as lithium niobate on insulator (LNOI), to get high speed modulation on a low-loss platform relevant for applications such as quantum computing. Geiselmann and his team created the bridge from fast R&D cycles in low volume PIC fabrication through multi-project wafer runs to high volume PIC fabrication in an automotive qualified CMOS line.

*** This presentation premiered during the 2024 Photonics Spectra Integrated Photonics Summit. For more information on Photonics Media conferences and summits, visit

About the presenter

Michael GeiselmannMichael Geiselmann, Ph.D., is president and CCO of LIGENTEC. He studied physics and engineering at the University of Stuttgart and École Centrale Paris and received his doctorate at the Institute of Photonic Sciences in Barcelona. In 2014, he joined the laboratory of Professor Tobias Kippenberg at the Swiss Federal Institute of Technology of Lausanne in Switzerland, where he advanced frequency comb generation on integrated silicon nitride chips and engaged in several international research projects. In 2016, Geiselmann co-founded LIGENTEC and brought the company to the international stage of photonic integration.
integrated photonicsquantum computingPIC testingfabrication
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