About This Webinar
Advanced packaging enables researchers to combine different technology platforms such as photonics, electronics, micro-electromechanical, and fluidics to address a vast array of exciting applications. These applications include telecommunications, quantum, medical devices, and sensing. Packaging processes also enable researchers to move device concepts beyond the lab to fully functioning systems, fostering collaborations with industrial partners. Professor Peter O’Brien presents the packaging capabilities established by his research team at the Tyndall Institute, including details about the group's diverse range of research projects in areas such as telecommunications, quantum, and medical devices. The webinar outlines how these advanced packaging processes can be transferred to early-stage manufacturing through the group's leadership of the European Pilot Line, and discusses recent developments by the group to establish the European Photonics Academy to train industry and students in a wide range of advanced photonic technologies.
Who should attend:
Engineers, R&D scientists, and manufacturers who utilize advanced packaging in integrated photonics. Those working in telecommunications, quantum, medicine, and sensing and detectors who are interested in gaining a further understanding of packaging or working with technologies such as electronics, electromechanics, and fluidics.
About the presenter:
Professor Peter O’Brien, Ph.D., is head of the Photonics Packaging & Systems Integration Group at the Tyndall Institute, University College Cork. He is also director of the European Photonics Pilot Line (www.pixapp.eu) and the European Photonics Academy at PhotonHub Europe (www.photonhub.eu). His group is involved in multiple EU, SFI, NSF, DARPA, and direct industry projects. O’Brien previously founded and was CEO of a start-up company that manufactures speciality photonic systems for biomedical applications, which he sold in 2009. Prior to this, he was a post-doctoral scholar at the California Institute of Technology and a research scientist at NASA’s Jet Propulsion Laboratory, where he was involved in the development of electronic submillimeter wave devices for remote sensing applications. He received his undergraduate degree and doctorate in physics from Trinity College Dublin and University College Cork respectively.
About the sponsors:
Aerotech Inc. is the global industry leader in precision motion control and automation. From standard positioning technologies, control systems, and light manipulation to custom-designed automation systems, their products support research and industrial organizations worldwide. Aerotech solutions enable manufacturing, testing, and inspection processes on a micrometer and nanometer scale for the world’s best-known technology companies in industries such as semiconductors, consumer electronics, and medical devices.
PI (Physik Instrumente) LP designs and manufactures high performance motion systems at locations in the U.S., Europe, and Asia. Industries and fields of application include silicon photonics wafer test, fiber alignment, laser processing, life sciences and microscopy, astronomy and aerospace, medical engineering, and big science projects. With 50 years of experience developing standard and custom motion and piezo products, and with more than 1500 employees in 15 countries, PI can quickly move customers’ positioning and automation projects forward.