Electro-Optical Circuit Boards Bridge the PICs Gap

Jan 12, 2023
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About This Webinar
Miniaturized electro-optical systems are finding their way into an increasing number of applications. While photonic integrated circuits (PICs) and components are maturing, the integration and packaging remains a major bottleneck for high-volume production. This is particularly true as the complexity of chips advances, the number of optical I/Os grows, and the electrical requirements for PICs get tighter. Hybrid integration methods, such as the use of electro-optical circuit boards (EOCBs), are one solution to bridging this challenge.

Flöry discusses the basic concepts, opportunities, and challenges of electro-optical co-engineering and showcases examples of successful EOCB-based hybrid PIC packaging applications.

***This presentation premiered during the 2023 Photonics Spectra Conference. For more information on Photonics Media conferences, visit

About the presenter

Nikolaus FlöryNikolaus Flöry, Ph.D., is a business development manager at Vario-Optics, where he works on integrated photonics applications based on the company’s unique polymer waveguide platform. He holds a master’s degree in physics and a doctorate in optical sciences, both from ETH Zürich.
photonic integrated circuitsPICselectro-optical
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