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Design Optimization & Sensitivity Analysis of Photonic Integrated Circuits

Author: Frank Scharf and Eugene Sokolov
Wednesday, December 05, 2018
This paper covers the use of design and simulation software in the development of photonic integrated circuits (PICs). Using the workflow put forward in this paper, users can analyze their PIC layout in 3D to calculate scattering parameters and characterize the effect of manufacturing tolerances on PIC performance in order to optimize the fabrication yield.
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File: 3DS_CST_Whitepaper_PIC_web.pdf (2.50 MB)
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