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Passive alignment:

Photonics Spectra
Jan 1998
Modular format offers robust future

Yasuhiro Suzuki, NTT Optoelectronics Laboratories

The cost issues of conventional optical module technologies arise from the long assembly time, the large number of components, and the need for costly hermetically-sealed packages. To overcome the above shortcomings, the industry needs innovative packages, assembly processes and device structures. In response, researchers have developed hybrid integration technologies, including passive alignment, lens-less optical coupling, and non-hermetically-sealed packages.

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