Close

Search

Search Menu
Photonics Media Photonics Buyers' Guide Photonics EDU Photonics Spectra BioPhotonics EuroPhotonics Industrial Photonics Photonics Showcase Photonics ProdSpec Photonics Handbook
More News
share
Email Facebook Twitter Google+ LinkedIn Comments

L-3 Communications Signs Agreement With IBM

Photonics.com
Mar 2004
NEW YORK, March 31 -- L-3 Communications announced today it has entered into a technology, product and engineering services agreement with IBM in which it intends to combine L-3's defense, aerospace and homeland security electronics leadership with IBM's expertise in chip and system design, technology integration, customization and the assembly and manufacturing of complex microelectronics.

The five-year agreement has a total expected value for IBM of approximately $80 million. L-3 said it will initially focus on customizing and developing application-specific integrated circuits (ASICs) for a variety of products and exploring ways L-3 can incorporate a variety of technologies into future products, including IBM's POWER (performance optimization with enhanced RISC) processing architecture.

L-3 and IBM are currently working together in the following areas:

L-3's Display Systems division is collaborating with IBM to develop advanced display systems for the US military. The project combines L-3 Display Systems expertise in military packaging and display design with IBM's advanced computing and functional miniaturization expertise to create a display product for use in special operations applications.

L-3 Security and Detection Systems is working with IBM's Engineering & Technology Services (E&TS) unit to explore ways to enhance the performance of its eXaminer 3DX 6000 explosive detection system. The company's Communication Systems-West division, L-3 CS-West, is working with E&TS to use IBM's POWER architecture to enhance specific defense electronics.

"We already are engaged in several design conversations on ASICs, and we expect the number of L-3 divisions working with IBM under the agreement will expand over time," said Pat Toole, general manager, IBM Engineering & Technology Services. "Working cooperatively, we will create new, innovative and cost-effective solutions."

For more information, visit: www.L-3Com.com


aerospaceCommunicationsdefensehomeland securityIBMindustrialL-3 CommunicationsmicroelectronicsNews & Features

Comments
Terms & Conditions Privacy Policy About Us Contact Us
back to top
Facebook Twitter Instagram LinkedIn YouTube RSS
©2018 Photonics Media, 100 West St., Pittsfield, MA, 01201 USA, info@photonics.com

Photonics Media, Laurin Publishing
x We deliver – right to your inbox. Subscribe FREE to our newsletters.
We use cookies to improve user experience and analyze our website traffic as stated in our Privacy Policy. By using this website, you agree to the use of cookies unless you have disabled them.