Search
Menu
Deposition Sciences Inc. - Difficult Coatings - LB - 8/23

Indium Promotes Ross Berntson

Facebook X LinkedIn Email
rossberntson.jpgRoss Berntson, director of Indium Corp.'s  solder products unit, was promoted to vice president of the unit, the company announced today. He will oversee sales and technical services for markets including printed circuit board assembly, semiconductor packaging, engineered solders and thermal interface materials. Berntson, who joined Indium in 1996 as a product specialist, has been instrumental in forging new marketing strategies and uncovering new market opportunities, Indium said. He is based at the company's Clinton, N.Y., headquarters.
Gentec Electro-Optics Inc   - Measure Your Laser MR


Published: April 2007
Glossary
indium
Metal used in components of the crystalline semiconductor alloys indium gallium arsenide (InGaAs), indium gallium arsenide phosphide (InGaAsP), and the binary semiconductor indium phosphide (InP). The first two are lattice-matched to InP as the light-emitting medium for lasers or light-emitting diodes in the 1.06- to 1.7-µm range, and the last are used as a substrate and cladding layer.
photonics
The technology of generating and harnessing light and other forms of radiant energy whose quantum unit is the photon. The science includes light emission, transmission, deflection, amplification and detection by optical components and instruments, lasers and other light sources, fiber optics, electro-optical instrumentation, related hardware and electronics, and sophisticated systems. The range of applications of photonics extends from energy generation to detection to communications and...
thermal interface materials
Thermal interface materials (TIMs) are substances or compounds used to enhance the thermal conductivity between two surfaces in contact. These materials are primarily employed in electronic devices, such as computer processors, LED lights, and power electronics, to facilitate the efficient dissipation of heat generated during operation. The main purpose of TIMs is to reduce the thermal resistance at the interface between the heat-generating component and the heat sink or cooling solution. ...
EmploymentindiumNews BriefsphotonicsPhotonics Tech Briefsprinted circuit board assemblysemiconductor packagingsolder productsthermal interface materials

We use cookies to improve user experience and analyze our website traffic as stated in our Privacy Policy. By using this website, you agree to the use of cookies unless you have disabled them.