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Bonding, Ball Bumping Among IWLPC Topics
Sep 2007
CARLSBAD, Calif., Sept. 11, 2007 -- Palomar Technologies, a Carlsbad, Calif., provider of precision automation equipment and process development and assembly services, will present “Geometry and Bond Improvements for Wire Ball Bonding and Ball Bumping” at the International Wafer-Level Packaging Conference (IWLPC) Sept. 19 at 3 p.m.

The paper, written by Palomar senior scientist Dan Evans, focuses on improving stitch bond formation of ball bumps in products such as wireless phones, PDAs and digital cameras. Steven Buerki, northwest regional account manager, will present.

IWLPC, sponsored jointly by the Surface Mount Technology Association and Chip Scale Review magazine will be held Sept. 17-19 at the Wyndham Hotel in San Jose.

Adaptive bond deformation, a method developed to control the geometry of both ball and stitch according to specified process parameters, will be discussed. The technique adapts to normal variations in bond surface, bond tool coupling, part fixture and other difficult-to-measure influences to produce bonded ball bumps and stitches.

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