Search Menu
Photonics Media Photonics Buyers' Guide Photonics EDU Photonics Spectra BioPhotonics EuroPhotonics Industrial Photonics Photonics Showcase Photonics ProdSpec Photonics Handbook
More News
Email Facebook Twitter Google+ LinkedIn Comments

Semiconductor Collaboration

Photonics Spectra
Sep 2009
An agreement to expand access to the 3M Wafer Support System equipment has been signed by 3M of St. Paul, Minn., and Suss MicroTec of Garching, Germany. The German company will become an authorized equipment supplier for the 3M system, which temporarily bonds the ultrathin wafers required for 3-D packaging. Suss MicroTec also will manufacture and sell wafer bonders designed to use 3M’s materials.

3-D packaging3M3M Wafer Support SystembondBusinessequipment supplierimaginglight speedsemiconductorSuss MicroTecultrathin wafers

Terms & Conditions Privacy Policy About Us Contact Us
back to top
Facebook Twitter Instagram LinkedIn YouTube RSS
©2018 Photonics Media, 100 West St., Pittsfield, MA, 01201 USA,

Photonics Media, Laurin Publishing
x Subscribe to Photonics Spectra magazine - FREE!
We use cookies to improve user experience and analyze our website traffic as stated in our Privacy Policy. By using this website, you agree to the use of cookies unless you have disabled them.