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Suss Expands in Wafer-level Camera Apps

Photonics.com
Jan 2010
GARCHING & MUNICH, Germany, Jan. 20, 2010 – Suss MicroTec, a supplier of process and test solutions for the semiconductor industry and related markets, announced that Q-Technology Limited (Q Tech), manufacturer of compact camera modules for the cell phone, notebook computer and security industry, has successfully installed a full Suss equipment set at Q Tech’s facility in Hi-Tech Industrial Park Kunshan City, Jiangsu Province, China.

The 200mm mask and bond aligner, spin and spray coaters, and wafer bond systems are utilized for Q Tech’s wafer-level camera manufacturing services.

With this project Suss MicroTec expands its activities as an equipment supplier supporting image sensor packaging and wafer-level camera manufacturing processes.

Wafer-level camera technology is capable of delivering significant size reduction over conventional camera modules in next-generation mobile devices like cell phones or PDAs. It is considered to be the first application to bring 3D packaging technologies into volume production.

For more information, visit: www.suss.com

200mm mask and bond aligner3D packagingAsia-PacificBusinesscamera modulescamerascell phonesChinadefenseEmploymentEuropeGermanyimage sensorsimagingindustrialnotebook computersPDAsQ TechQ-Technology Limitedsecurity industrysemiconductorsSensors & Detectorsspin and spray coatersSuss MicroTecwafer bond systems

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